The first brand of ultra-precision parts machining precision parts mainly what?
Ultra-precision parts machining
There are ultra-precision turning, grinding and polishing the mirror. In the ultra-precision lathe with finely ground single crystal diamond turning tool trace turning, cutting thickness of only about 1 micron, commonly used in the processing of non-ferrous materials spherical, aspherical mirrors and other high-precision flat, smooth surface height Components. E.g., the processing fusion device having a diameter of 800 mm the aspherical mirror, the most accurate up to 0.1 m, the surface roughness of Rz0.05 microns.
Special ultra-precision machining parts
Ultra-precision machining accuracy in nanometers, or even ultimately to atomic units (atomic lattice distance of 0.1 to 0.2 nm) when targeting ultra-precision parts machining methods can not meet the need by the process of special precision machining parts, namely Applied Chemistry energy, electrochemical energy, heat or electricity, so that these energies beyond the binding energy between atoms, thereby removing the attachment portion between the surface atoms, binding or lattice deformation, in order to achieve ultra-precision machining. Belong to this type of processing chemical mechanical polishing, ion sputtering and ion implantation, electron beam exposure shot, laser beam machining, metal deposition and molecular beam epitaxy. The characteristics of these ultra-precision parts machining method is to remove the surface layer of the substance or the amount added can make very fine control. However, to obtain ultra-precision machining accuracy still depends on precision processing equipment and precise control system, and the use of ultra-precision mask as intermediary. For example VLSI plate is to use electron beam on the photoresist mask (see photolithography) in exposure shot, make the photoresist electrons strike atoms in the direct polymerization (or decomposition), and then with a developer over the polymerization or polymerization had partially dissolved away, made masks. Electron beam exposure shot plate need to use table positioning accuracy up to ± 0.01 micron ultra-precision machining equipment.
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